1. Suitable for a variety of component desoldering and soldering, such as: SOIC,CHIP, QFP, PLCC, BGA, SMD, etc.(especially for mobile phone repair)
2. Suitable for heat shrinking, drying, painting, adhesive removal, thawing,preheating, plastic welding, etc.
3. Providing power supply for mobile phone repair and circuit board voltage test,detecting mobile radio signal’s strength, etc.